The landmark CPIF China Packaging Innovation Forum convened recently at the Shanghai Marriott Hotel Parkview. Under the guidance of the China Packaging Federation and backed by prominent global entities including the United Nations Environment Programme (UNEP) and the International Association of Packaging Research Institutes (IAPRI), the high-profile summit was jointly organized by Reed Exhibitions and the Packaging Promotion Committee. Embracing a global, forward-looking vision, the event convened approximately 900 elite delegates from hundreds of organizations—spanning government agencies, NGOs, trade associations, Fortune Global 500 market leaders, renowned designers, distinguished global scholars, and pioneering packaging firms—to drive critical dialogues around packaging innovation in the era of the New Plastics Economy.

Mr. Xu Liangheng, Chairman of Techsun, was invited as a featured speaker at the main plenary session, where he delivered a compelling keynote address titled "Disruptive Technical Innovation: Creating a Blue Ocean Within a Red Ocean." During his presentation, Chairman Xu shared the strategic rationale behind Techsun’s bold, cross-sector expansion from security and anti-counterfeiting into the broader packaging arena. He detailed how Techsun redefined its corporate positioning within the massive packaging ecosystem, effectively shattering industry paradoxes through an R&D philosophy centered on "upgraded technology at optimized costs," while presenting a transformative blueprint to capture untapped market space within a saturated "red ocean."

Addressing the acute bottlenecks facing today's packaging sector, Chairman Xu introduced Techsun’s latest breakthrough engineered to disrupt the status quo: the "Techsun All-in-Print^® Packaging." This pioneering product seamlessly consolidates multiple high-end printing methodologies, consolidating complex multi-stage pre-press workflows into a single, streamlined process. By simultaneously elevating aesthetic premiumization and radically driving down operational costs, the All-in-Print^® Packaging injects a powerful new paradigm into industry innovation, earning widespread acclaim and intense interest from onsite experts, industry peers, and end-market brand owners.

Throughout the three-day summit, an influx of forum delegates engaged with Techsun representatives on-site to explore commercial applications and strategic partnership opportunities for the All-in-Print^® Packaging.