The China Anti-Counterfeiting Packaging and Product Traceability Supply-Demand Forum convened successfully in Shanghai. Hosted by the China Packaging Federation, the high-profile event was jointly organized by the federation's Anti-Counterfeiting Packaging and Product Traceability Committee, Techsun’s subsidiary Shanghai Techsun Anti-Counterfeiting Technology Co., Ltd., and Reed Exhibitions. The forum gathered approximately 300 elite delegates, spanning leading security and packaging printing enterprises, end-market brand owners, and distinguished academic and research institutions.

Mr. Xu Liangheng, Chairman of Techsun, attended the forum and delivered a compelling keynote address titled "Transforming Anti-Counterfeiting into a Core Market Demand and an Indispensable Business Asset." Addressing the evolution of the authentication and packaging sectors over the past four decades since China's Reform and Opening-up, Chairman Xu shared his visionary insights on scaling and strengthening the industry. Crucially, he introduced a transformative blueprint for the strategic convergence of "Anti-Counterfeiting + Smart Packaging" to disrupt the current market landscape.

A major milestone of the forum was the official unveiling of Techsun's latest breakthrough: the "Techsun All-in-Print^® Packaging"—a high-tech optical substrate that seamlessly consolidates eight distinct layers of advanced technology. Chairman Xu detailed the pioneering technology, competitive product advantages, diverse application scenarios, and innovative business models behind the All-in-Print^® Packaging. The presentation garnered intense interest and widespread acclaim from industry experts, peer corporations, and end-user brand owners alike, cementing it as the definitive highlight of the forum. During executive networking intervals, an influx of corporate delegates swarmed Techsun representatives to explore commercial adoptions and strategic partnerships.

Undoubtedly, the fusion of "Anti-Counterfeiting + Packaging" represents the inevitable evolution of the packaging sector, positioning Techsun as both a pioneer and a prime disruptor driving this paradigm shift. The introduction of the Techsun All-in-Print^® Packaging injects a powerful new methodology and visionary framework into the industrial upgrading of the global packaging ecosystem.