Two landmark events in the packaging sector—the 2019 China Packaging Container Expo and Luxe Pack Shanghai—convened successively in Shanghai, driving intense industry dialogue. Shanghai Techsun showcased its groundbreaking All-in-Print^® Packaging at both venues, capturing widespread attention from a diverse group of domestic and international trade visitors. The product generated an enthusiastic market response, triggering a continuous influx of on-site inquiries and commercial consultations throughout the events.

2019 China Packaging Container Expo

Engineered with a premium plastic substrate, the Techsun All-in-Print^® Packaging is a high-tech optical substrate that seamlessly consolidates eight distinct technology layers, including LenScape, cat's eye optics, holography, and micro-relief embossing. By seamlessly fusing proprietary localized optical replication technology with conventional printing methodologies, the platform compresses complex, multi-stage pre-press workflows into a single, streamlined production run. This clever modularization of prepress stages has led industry insiders to revere the All-in-Print^® Packaging as the "integrated microchip" of the printing and packaging ecosystem.

The versatile All-in-Print^® Packaging can be laminated with various paper elements to craft an array of premium structural packaging configurations. It offers extensive application scenarios across high-end retail sectors, including wine and spirits, tobacco, and cosmetics. Beyond dramatically elevating packaging aesthetics and anti-counterfeiting security, it significantly drives down structural operational costs. The introduction of the Techsun All-in-Print^® Packaging injects a powerful new methodology and visionary framework into the industrial upgrading of the global packaging market.